BP 8/20/26 BP 8/20/26

GaN Package for FOPLP

Maskless Embedded GaN Architecture

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BP 8/20/26 BP 8/20/26

Chip Scale Thermal Pad: Thermal Management for 16-Hi HBM and Co-Packaged Optics

Backside Thermal Pad for AI/HPC and HBM Packaging

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BP 8/13/26 BP 8/13/26

Next-Gen Space Semiconductor Technology: 3D Solar Stack with Embedded Photonics

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Steve Jin 8/15/25 Steve Jin 8/15/25

Integrated edge emitter laser diode packaging

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BP 4/17/25 BP 4/17/25

OIP Corporate Summary

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research BP 4/17/25 research BP 4/17/25

Chiplet tech to transform semicon ecosystem

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Manufacturing, Event BP 4/17/25 Manufacturing, Event BP 4/17/25

3rd Generation Panel Level FOPLP for Integrated Optical Module and High-Power Package

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Technology BP 5/28/19 Technology BP 5/28/19

Leveraging 3-D Stacking (3rd Gen Technology)

3-D Stacking Advanced Packaging

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