Advanced Packaging Solutions:

Optical · Intelligence · Power

Optical module: ultra thin optical module (0.15mm thick) for mobile and wearable devices

AI Optics: CPO, Optical I/O

Power package: Advanced packaging with low power consumption.

A digital illustration of a computer processor chip with multiple colored pins and pathways on a blue background.

Experts in optical interconnect leveraging CPO

We are a semiconductor advanced packaging firm focused on manufacturing and custom design for the world’s leading technology innovators and companies.

Integrated laser diodes package
A close-up view of a blue perforated metal surface with evenly spaced square holes, revealing multicolored lights beneath.

OIP TECHNOLOGY

OIP TECHNOLOGY

    • Silicon photonics module with edge coupling and top coupling.

    • Ultra-thin VCSEL module package.

    • Chip scale thermal pad.

    • 3D stack chiplet for optical and high power applications.

    • 3rd generation FOPLP with integrated optics and chips.

    • Patented Thin Mini-LED Display.

    • Integrated solar panel module.

    • AI

      • Photonics module(Transceiver and Data center co-packages)

      • AI optics pluggable FAU (for AI GPU)

    • Consumer

      • VCSEL sensor

      • CIS module

    • Energy

      • Integrated solar

      • Flexible package

    • Automotive

      • Lidar sensor

      • High Power packages (Hybrid TO, BSM, Two-sided metal packages)

      • Chip scale atomic clock

    • Semiconductor assembly.

    • Panel level test.

    • Research and Development

    • High frequency product

    • Good heat dissipation.

    • Optical package thickness reduction.

  • We provide custom design, manufacturing and project services to the world’s leading technology companies. Connect with us to learn more.

Digital illustration of a computer chip with the letters 'OTP' on top, emitting blue light on a circuit board.

AI / HPC

  • Top coupling

    Edge coupling

    Chip scale thermal pad

  • Connect fibre optics to chip

Close-up of a large solar panel with the letters 'OIP' on it, set against a clear blue sky with the sun shining.

Renewable Energy

    • Low light applications.

    • Low power consumption with Integrated chip.

    • 100% light absorption design.

    • Narrow die gap at 10um

A pair of dark-colored smart glasses with bispectral displays, one of which is open, showing a small, square, gold-colored microchip or sensor hovering below it, with another similar chip positioned inside the lens.

Consumer

    • Ultra-thin package at 0.2mm for wearable devices.

    • Integrated driver IC and LED.

    • Single pixel control.

    • Excellent thermal performance.

    • Low CTE mismatch

    • New EMC material enable 180 degree bending.

Electric blue car being charged at an electric vehicle charging station.

Automotive

  • . Applicable for Lidar module

    . Large metal post for high current.

    . Excellent thermal dissipations,

  • . Thick metal RDL.

    . 2-side metal exposed.

Contact Us

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