Leveraging 3-D Stacking (3rd Gen Technology)

At OIP we are experts in advanced manufacturing leveraging 3rd gen technology. For many of our project we find that there are substantial benefits for technology.

  • Integrated optical and electronic components

  • Enable Optical-in-Package system

  • Large density chips, >10 chips

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3rd Generation Panel Level FOPLP for Integrated Optical Module and High-Power Package