AI + HPC

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AI + HPC 〰️

3D optical Chiplet enabling the next frontier of AI and HPC needs

  • Silicon Photonics Module (Edge Coupling).

    Improve bandwidth through integrated fibre optics.

    Enable fiber optics top coupling and edge coupling. 

    Chip scale thermal pad on backside of die.

  • Optical I/O (Top Coupling)

    Enable fiber optics connection to topside of photonics chip via optical I/O.

    Pluggable optical I/O.

    Reflowable optical I/O.

  • Modular AI Optical pluggable FAU

    Modular and enabled for fibre optics coupling.

    3D Optical chiplet design.

    Chip scale Thermal pad.