Optical Packaging Solutions: CPO, Optical I/O and Laser Diode Array

  • A diagram of a microchip showing multiple connected pathways and connectors.

    Co-Packaged Optics Platform

    • Silicon photonics-based CPO

    • Supports both top and edge coupling

    • Chip-scale thermal pad on the die backside

  • Close-up of a metallic surface with a grid of small, evenly spaced square holes, reflecting colorful lights from underneath.

    Optical I/O (Top Coupling)

    • Enables fiber-optic connection to the top surface of the photonic chip.

    • Pluggable optical I/O

    • Reflow-compatible optical I/O

  • Diagram of a laser diode module showing laser diode, anode, cathode, and electrical connections.

    Edge-Emitting Laser Module

    • Modular design enables fiber-optic coupling

    • Excellent BLT and die-tilt control

    • Reduces optical coupling and alignment time by up to 80%

    • ±5 μm die-placement accuracy

    • Excellent thermal dissipation design.

  • 3D uLED Package

    • Driver and LED integration.

    • Low cost 3D structure.

    • FOPLP process.