AI + HPC

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AI + HPC 〰️

3D optical Chiplet enabling the next frontier of AI and HPC needs

  • A diagram of a microchip showing multiple connected pathways and connectors.

    Silicon Photonics Module (Edge Coupling).

    Improve bandwidth through integrated fibre optics.

    Enable fiber optics top coupling and edge coupling. 

    Chip scale thermal pad on backside of die.

  • Close-up of a metallic surface with a grid of small, evenly spaced square holes, reflecting colorful lights from underneath.

    Optical I/O (Top Coupling)

    Enable fiber optics connection to topside of photonics chip via optical I/O.

    Pluggable optical I/O.

    Reflowable optical I/O.

  • Diagram of a laser diode module showing laser diode, anode, cathode, and electrical connections.

    Modular AI Optical pluggable FAU

    Modular and enabled for fibre optics coupling.

    3D Optical chiplet design.

    Chip scale Thermal pad.