OIP Corporate Summary
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OIP Technology Pte Ltd.
“Powering Connections, Accelerating Innovation, Packaging the future”
About
OIP Technology operating in high growth margin markets such as AI, mobile, wearable products, new displays, and 5G data centres. We use panel-level based platform and semiconductor thin film process to develop a third generation of embedded chip technology.
Our Mission
To empower next-generation semiconductor systems with high-performance optical and high-efficiency power chiplet solutions, seamlessly integrated through advanced packaging technologies.
Our Offering
High-Performance Optical Chiplet
Ultra-high bandwidth optical IO for data-intensive systems
Optimized for AI accelerators, data centers, HPC, and aerospace
Low-latency, high-reliability optical transceivers and interfaces
High-Efficiency Power Management Chiplets
Precision power delivery and regulation
Supports heterogeneous integration with leading-edge compute and analog chiplets
Built on mature nodes for cost efficiency and high yield
Opportunties
Silicon Interposer, Embedded Bridge, Fan-Out, and 3D Hybrid Bonding
Optimized layouts for signal integrity, power delivery, and thermal performance
Full stack packaging design and assembly capabilities
Key Benefits
Modular Design - Flexible system architectures with mix & match chiplet configurations
Faster Time to Market - Rapid prototyping and accelerated product development cycles
Cost Efficiency - Reduced NRE costs and optimized manufacturing yield
High Reliability - Rigorous testing for known-good die (KGD) and system-level quality assurance
Ecosystem Ready - Open standard interfaces (UCIe, BoW) for seamless integration
Scalable Solutions - Support for volume manufacturing and niche high-performance segments
Target Applications
📡 Data Center & AI Infrastructure
🚗 Automotive Power Management & Optical Sensors
🛰️ Aerospace & Defense Systems
💡 Energy-Efficient IoT Devices & Solar
🖥️ High-Performance Computing & Networking Equipment
🤝 Why Partner with Us?
✅ Deep expertise in heterogeneous integration and manufacturing
✅ Pioneer in optical chiplet and power package applications
✅ Proven manufacturing partnerships and supply chain network
✅ Commitment to customer-first co-design collaboration
Let’s build the future of semiconductor systems, chiplet by chiplet.
