Next-Gen Space Semiconductor Technology: 3D Solar Stack with Embedded Photonics
Our heterogeneous packaging platform merges high-density solar energy collection with low-latency optical interconnects.
Low-Resistance Interconnection for Back-Contact Solar Cells Using 100 μm Copper RDL
In an outdoor engineering test conducted on 8 July 2026, OIP Technology's 100 μm Cu RDL interconnection demonstrated approximately 40% lower measured series resistance and up to 34% higher measured output power than the conventional solder-ribbon reference. Independent STC validation is planned.
Localized 100 μm Cu RDL interconnect between neighboring BC cells. The photograph is taken from the 8 July 2026 engineering test configuration.
Figure 1. Actual OIP 100 μm Cu RDL test module. The Cu RDL forms the inter-cell connection between adjacent BC-cell terminals and does not cover the full backside of each solar cell.
